Cadence Design: Will Demonstrate Clarity Release 2022.1 at DesignCon in Booth Demos and Customer Presentations

New Electromagnetic Analysis Capabilities in Design Accelerate the design of high-performance ICs, IC packages, and PCBs

SAN JOSE, Calif. (DesignCon) – Cadence Design Systems, Inc. will showcase the latest version of Cadence® Clarity™ 3D Solver for Electromagnetic (EM) Analysis Embedded in the Design of ICs, IC Packages, and High-Performance PCB Designs at DesignCon 2022 in Booth 927, as well as in Multiple Customer Presentations Throughout throughout the conference. Visit our DesignCon web page for more information and to register for training sessions.

WHAT: Cadence experts will demonstrate new features and workflows enabled by the latest version of the 3D Clarity Solver, 2022.1, including:

  • New distributed mesh offering at least 10 times better performance

  • Optimization based on artificial intelligence and machine learning (AI/ML) that quickly and efficiently explores the design space and produces optimal designs

  • Seamless Integrated Workflows with Cadence Allegro®/Allegro Package Designer Plus, Integrity™ 3D-IC, Virtuoso® RF and AWR® microwave/RF platforms

“Electromagnetic (EM) analysis for IC packages and high-performance PCB designs is gaining in scope and complexity, especially for interposition and rigid bending applications,” said Ben Gu, vice-president President of the Multiphysics Systems Analysis Business Group at Cadence. “Increasingly, customers rely on the speed, accuracy and capability of the Cadence Clarity 3D solver to deliver these complex designs on time.”

Distributed mesh

Clarity 3D Solver’s advanced meshing technology continues to grow with the addition of new distributed meshing algorithms that now include both layer-based (LMesh) and arbitrary 3D (XMesh) approaches. Both techniques speed up the initial meshing process by more than 10 times, resulting in a significant reduction in simulation run times.

“Design complexity is increasing in 3D ICs and for advanced bead array (BGA) substrate designs, we need a better meshing tool to ensure that finite element method extraction (FEM) 3D is effective,” said Dr. Stephen Chen, Director of High Speed ​​Signal and Thermal Simulation Department of GUC. “Compared to the previous meshing tool in Clarity 3D Solver, we find that the new XMesh approach significantly reduces our meshing time in advanced package designs and additionally improves performance in a model extraction process. full.”

AI-based optimization

Resource-intensive and time-consuming parametric sweeps are typically used by engineers to optimize both the physical structure and the electrical behavior of their designs. With the introduction of new AI/ML techniques, Clarity 3D Solver dramatically improves designer productivity and analysis efficiency to focus on design.

Workflow

The Clarity 3D Solver continues to be integrated as a seamless EM design analysis solution into the Allegro/Allegro Package Designer Plus, Integrity 3D-IC, Virtuoso RF and Microwave/RF AWR platforms to enable customers to speed up their design. workflows throughout production.

In addition to the on-stand demos, the following presentations will showcase Cadence Design System Analysis workflow solutions as part of the Cadence-sponsored session on Thursday, April 7, 2022 in the Mission City Ballroom – B5:

  • Amphenol: Design/Analysis Workflow of 112G Connectors and Boards
  • Meta (Facebook): MIPI®-C Board and Camera Interface Design/Analysis Workflow
  • Microsoft: Optimization of the interconnection of portable devices with an analysis workflow in design

WHEN: DesignCon will take place April 5-7, 2022.

OR: Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, CA. Cadence is at stand 927.

About cadence

Cadence is a proven leader in electronic systems design, backed by more than 30 years of computing software expertise. The company applies its underlying Intelligent Systems Design strategy to deliver software, hardware and intellectual property that turn design concepts into reality. Cadence customers are the most innovative companies in the world, delivering extraordinary products from chips to boards to complete systems for the most dynamic applications in the market, including large-scale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For seven consecutive years, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at www.cadence.com.

© 2022 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and other Cadence marks available at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc.

Abdul J. Gaspar